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CK450B Magnetron Sputtering Coating System

The device features a circular vacuum chamber with dimensions of Φ450×350mm, equipped with three standard permanent magnet magnetron targets. The sample stage supports programmed temperature control up to 600°C, self-rotation, and public position conversion, along with a-200V negative bias function. Integrated with a quartz crystal oscillator thickness gauge and computer control system, it enables precision coating deposition and real-time data acquisition, making it suitable for the development of multilayer functional films.

Details

CK450B Magnetron Sputtering Coating System (1).jpg CK450B Magnetron Sputtering Coating System (2).jpg

1. Overview of Equipment and Application Fields

The CK450B magnetron sputtering coating system is a high-end multifunctional vacuum coating equipment, specifically designed for the preparation of nanoscale single-layer and multilayer functional films, rigid films, metal films, semiconductor films, and dielectric films. This system is widely used in film material research at universities and research institutes, as well as in the trial production of small-batch, high-precision samples. With its excellent temperature control performance and precise computerized control system, the CK450B can meet the high-quality film formation requirements under complex process conditions.

2. System Composition Architecture

The CK450B system is highly integrated with the following core modules:

· Vacuum chamber system: includes main sputtering chamber and the upper cover lifting mechanism.

· Target and power supply system: Equipped with 3 magnetron targets and corresponding high-voltage power supply.

· Sample stage system: A multifunctional sample stage supporting heating, rotation, and universal position conversion.

· Vacuum pumping and measurement system: molecular pump or cryopump with scroll dry pump system.

· Airway and control system: precision mass flow control and automatic computer control center.

· The thickness measuring system is a high precision quartz crystal oscillator monitor.

· Auxiliary systems: including water cooling, electronic control and safety interlock devices.

3. Core Functional Highlights

· The triple-target co-sputtering system features three standard permanent magnet magnetron targets with an effective sputtering area of 3 inches × 3 inches, employing an indirect water-cooling structure. Its unique straight-target upward sputtering design optimizes particle transport paths, enhancing both film formation efficiency and uniformity.

· The high-temperature programmable temperature control technology features a sample stage with robust heating capability, capable of reaching a maximum temperature of 600°C±1°C, and supports programmable temperature control. Users can preset complex heating, holding, and cooling curves to meet the specific process requirements of high-temperature annealing and in-situ film formation.

· The multidimensional motion sample stage (compatible with 3-inch × 3-inch, 3.2mm-thick planar samples) supports rotation (0-50 rpm) to ensure uniform film thickness, while its orbital function enables multi-position coating, significantly enhancing experimental flexibility.

· computer intelligent control system

o Real-time data acquisition: the real-time acquisition and error calculation of the sample displacement and the orbital speed with time.

o Visualization: Supports dual display modes for curves and numerical values, with orbital speed enabling free switching between linear and logarithmic scales for displacement curves.

o Precision coating: Achieves position-specific coating through precise control, meeting micro-area processing requirements.

· The substrate stage supports **-200V negative bias** output, which effectively improves film adhesion and density while removing surface impurities.

4. Technical Parameters and Specifications

Parameter item

qualification

vacuum performance

Extreme vacuum: 6.7×10⁻⁵ Pa

System leakage rate: 1×10⁻⁷ Pa·L/S

Recovery time: After exposure to atmospheric conditions and filling with dry nitrogen, the pressure can reach 6.6×10⁻³ Pa within 40 minutes.

vacuum chamber specifications

Circular vacuum chamber, dimensions Φ450mm × 350mm

magnetron target configuration

Quantity: 3 pieces

Specifications: 3-inch × 3-inch standard permanent magnet target

Cooling method: indirect water cooling

Sputtering direction: upward

sample holder system

Sample size: 3 inches × 3 inches (thickness 3.2 mm)

Heating temperature: up to 600°C ±1°C (programmed temperature control)

Motion mode: Rotation (050 rpm) + Revolution (Positional change)

electrical parameters

Substrate bias: -200V (negative bias)

airway control

2-channel high-precision mass flow controller (MFC)

film thickness monitoring

Quartz Crystal Oscillator Thickness Controller, Measuring Range 0-999,999 A

vacuum system

Optional configurations: molecular pump set or cryopump + scroll dry pump combination

control software

Supports real-time displacement/velocity acquisition, error calculation, linear/logarithmic curve switching, and fixed-point coating control

5. Why choose CK450B?

The CK450B magnetron sputtering system distinguishes itself in scientific research equipment with its 600°C programmable temperature control and unique three-target upward sputtering design. Its advanced computerized control system not only automates and visualizes the process, but also ensures precise preparation of complex multilayer film structures through high-precision displacement and speed control. Whether for high-temperature superconducting film research or developing novel optical coatings, the CK450B stands as your trusted research partner.